ࡱ> npm uVbjbjVV 4n<<ON%   8E,q4 1"~64j1111111$235 +1!!!+1@1###!^1#!1##m/h0*% X"/0V101/7"7 070H*#t+1+1#1!!!!7 : Government Electronics and Information Technology Association (GEIA): Overview and January 2004 Committee Meeting Highlights EIA/GEIA Overview Most engineers in the electronic parts and packaging field are aware of the Electronic Industries Association (EIA) and its many subsidiary organizations, including the Government Electronics and Information Technology Association (GEIA). GEIA promotes the interests of the U.S. electronics, communications, and information technology industries, with regard to Government markets, requirements, and technical standards at the Federal, State, and local levels. The GEIA is the home of the G-12 and G-11 Committees for Solid State Devices and Component Parts, respectively. The G-12 Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices and writes EIA standards and specifications to capture the newest best practices and guidelines or recommends changes to the military specifications and standards as applicable. The G-11 Committee does this as well, but it is normally focused on passive part types, while the G-12 Committee almost exclusively examines active parts and packaging issues. Both of these committees fall under the purview of the Systems, Standards, and Technology Council (SSTC), which acts as the technical advisory group to the GEIA Board of Directors and is a forum for discussion of technical management matters, preparing industry positions on proposed legislation, studies, regulations, standards, and related documents. The NASA Electronic Parts and Packaging (NEPP) Program supports NASAs participation in the G-11 and G-12 quarterly meetings normally sending several representatives though they participate as guests of the GEIA because it is an industry association. Following a month of work on the Web site, the GEIA area is back up and running and can be accessed by going to  HYPERLINK "http://www.geia.org" www.geia.org, pulling down the Councils & Committees link on the menu bar, choosing Systems, Standards, and Technology Council (SSTC), and then selecting either the G-11 link or the G-12 link. This page shows recent white papers, the schedule for the next two quarterly meetings, prior meeting minutes, and contact information for the chairman. To access the two most recent meeting minutes and agenda information for the G-12 Committee, click on the Members icon and enter the following ID and password: G12, EIA5962. The G-12 meeting, over its 4 days, hosts a number of subcommittee meetings, liaison reviews with the Defense Supply Center Columbus (DSCC) points of contact on electronic parts standards and specifications, and reports from other Government and related organizations such as NASA, the Aerospace Corporation (for their customer the U.S. Air Force Space and Missile Systems Center), the European Space Agency (ESA), the Defense Semiconductor Association, and the Automotive Electronics Council (and many more). The subcommittees cover the following subjects: Semiconductors Microcircuits Radiation Hardness Assurance (RHA) and Characterization Hybrids and Multi-chip Modules (MCMs) Mechanical Standards Quality and Reliability of Solid State Products Diodes Plastic Encapsulated Microcircuits (PEMs) Radio Frequency (RF) and Microwave Parametric Control for MIL-PRF-19500 Specifications Residual Gas Analysis (RGA) Discrete Power Devices Standardization Design Guidelines for Satellite Parts Coefficient of Thermal Expansion (CTE) Mismatch Hybrid Resistance to Soldering Heat Glass Strain Thermal Transient Impedance Implementation for Junction Field Effect Transistors (JFETs) Failure Rate Estimating Methods Scanning Acoustic Microscopy Test Methods Corona Breakdown Lead-Free Issues, Device Marking for Ultra-sensitive Electrostatic Discharge (ESD) Devices Derating, MIL-STD-883 Test Method Issues Accelerated Burn-in Regression for Glass Power Diodes Ball Grid Array (BGA) Standardization. The G-11 Committee had an operating hiatus in the 1990s but has recently started meeting again. A similar mix of industry and Government organizations is represented at the G-11 meetings, including a NASA presence. The NEPP Program supports this meeting, including the chairmanship of the Capacitors and the Filters and Networks subcommittees. The subcommittee topics include the following topics: Capacitors Circuit Breakers Connectors Filters and Networks Coils and Transformers Fuses and Lightning Arrestors Hardware Insulators and Insulating Materials Oscillators and Crystals Relays Resistors and Resistance/Capacitance (RC) Networks Switches Wire and Cable. January 2004 EIA G-12 Committee Meeting, Phoenix, Arizona Below are highlights from the EIA G-12 Committee Meeting held January 2004 in Phoenix, Arizona. Key points are illustrated for several segments of the 4-day meeting, such as the AQEC (Aerospace Qualified Electronic Component) Overview, RGA (Residual Gas Analysis) Workshop, Joint Electron Device Engineering Council (JEDEC) 13.2 Subcommittee Meeting, and G-12 Space Parts Subcommittee Meeting, as well as a list of relevant upcoming meetings and a summary of action items resulting from the Committee Meeting. DSCC (Defense Supply Center Columbus) Audits: DSCC repeated their offer to allow original equipment manufacturers (OEM) representatives to participate in DSCC audits. Microsemi Relocation: In the move of Microsemi from Santa Ana, California, to Scottsdale, Arizona, the IPG company is slated to assume Santa Anas wafer fabrication. The Scottsdale group will be getting most of the Santa Ana product except for the 1N6638-6643 family, which will go to Lawrence, MA. All modules will go to Lawrence as well. The transition is expected to take 18-24 months, and DSCCs next audit has been moved up to April 2004. Temperature Derating of Discretes: Temperature derating of discretes has traditionally contained an error: Leakage current causes heating even at very low power levels, and the curve is no longer linear as it curves away at low power. The practical implication is an unappreciated risk of thermal runaway, but some experts are not convinced of this arguments merit. There was a proposal to define Top as case or ambient temperature, and to use the operating temperature of the device instead of Tj. Derating curves could be for Top and/or Tj, depending on the degree of difference between the two. Some experts indicated that there is little practical implication in including a mounting method in the specification, although others maintained that the heat sinking of the mounting system greatly influences the temperature rise. Updates and Upgrades to SD-18 (Defense Standardization Program Guide for Part Requirements and Application): Funding for updates and upgrades to SD-18 has been approved and is imminent. Navy Crane is examining structure changes to improve usability. For example, they recommended updating the sections on passives and derating and uprating, and adding sections on lessons learned and design guidelines, diminishing manufacturer sources and material shortages (DMSMS), flat panel displays (to be added by AMCOM), and ethylene tetrafluoroethylene (ETFE) wire guidance. This list will need to be prioritized with respect to funding. AQEC (Aerospace Qualified Electronic Component) Overview: Corona Test Method Task: It is not clear whether the Corona Test Method task should continue. It has been requested by NASA Johnson Space Center (JSC), but ability to work on the task has diminished. MIL-STD-1580C: The task involving MIL-STD-1580C is needed to fill the gaps that were left in Revision B. There was discussion of adding some guidance on which parts should undergo DPA (destructive physical analysis) to the space parts guidelines. Long-Term Storage Task: A draft of the Long-Term Storage task was issued for review. This task will involve a cooperative effort with White Sands technical/experienced input. A large volume of industry and Government documents on this subject were reviewed and used to prepare the draft. GIDEP Alert CE9-A-04-02: The parts identified in the recent Government/Industry Data Exchange Program (GIDEP) Alert CE9-A-04-02 are only made and tested in Thailand, though the alert does not make this clear. The Thailand facility is not owned by Texas Instruments; rather, it is owned by a contractor with a US Military Qualified Manufacturers List (QML) V certified line. The problem discussed in the alert is one that has occurred before at that location. Residual Gas Analysis (RGA) Workshop Failure Limits: The current test method can allow a 20% failure rate. The original intent was to prevent premature wear-out failures due to internal moisture; the suggested objective was to assure that parts do not fail from excessive internal moisture. The test labs, not DSCC, are responsible for developing robust, accurate, reproducible test procedures. Today, the majority of the population in the lot is under control and meets 5,000 ppm, but now there are leak test escapes, which are random in nature and may exceed 5,000 ppm. These can constitute 20% of the population. Labs are very different in equipment procedures and calibration approach. Oneida considers 5,000 ppm to be a suitable limit, as most failures they see are very high (15,000+ ppm). Oneida recommends a process monitor; Telcordia requires an 11/0 Accept/Reject plan at 5,000 ppm. RGA Results: Pernicka Corporation maintained that packages contained components of atmospheric air and not leak test residues (helium and fluorocarbons). The process is controlled carefully to produce samples of two similar packages (double sealed, a lid on top and bottom), with one lot of packages having a thicker nickel-plated layer than the other. RGA results showed an oxygen to argon ratio of 20:1 but low H2. Moisture content might not be constant because reactions with hydrogen, oxygen, and organics may be occurring. RGA produces information on other materials such as argon and hydrocarbons, but no requirements or limits for these materials are specified. Helium Leak Detection: An experiment revealed parts that have moisture close to 5,000 ppm, high oxygen content, and a 20:1 oxygen/argon ratio, and no helium or fluorocarbons, but the extracted gas volume was high. All of this suggests a leaker, but the reason for the lack of helium is unclear (it could indicate a one-way leaker). Packages with anomalous results were cross-sectioned through the seals (this gives four point samples of the seals because of the two lids). One part showed what appears to be the first documented example of a one-way leaker. It was a long, narrow separation between the nickel and the base metal. The root cause was a defective seam sealer that provided an occasionally lower-than-optimum pressure that allowed minute blow-out between the nickel plating and the base metal. This leak is stress sensitive, and it is suspected that helium bombing pressure squeezed it shut, hence the <100 ppm helium. Other samples showed very high moisture, oxygen, and gas volume, but no helium or fluorocarbons. Yet others showed low moisture but high oxygen and volume extracted but no helium or fluorocarbons. Pernicka checked all of the controls and calibrations to try to identify any error that could have caused the results, but no errors were found. Note: The current specification states that values of elements below 100 ppm do not have to be recorded, so in the discussion above, no helium means <100 ppm. One Pernicka recommendation is to have all values recorded to assist in diagnosis. Pernicka stated that cumulative helium leak detection overcomes deficiencies with current fine and gross leak tests. There appears to be light at the end of the tunnel for RGA and hermeticity for small packages. DSCC Package Testing: DSCC stated that results were shown on a 0.1 cc package that was sealed with an atmosphere of 2,850 ppm of moisture. After correcting process weaknesses, an average of 2,890 ppm, with a sigma of 80 ppm, was achieved on a six-piece sample of empty packages. Unfortunately, only three samples of the 0.1 cc packages could be supplied to each of the six labs because a number of parts could not be sealed satisfactorily. DSCC plans to do 1.0 cc packages next; 0.01 cc will be tried once experience on the easier package sizes has been accumulated. JEDEC 13.2 Subcommittee Meeting M38535 Testing: A major U.S. Air Force contractor is requiring that their internal and sub-contractor procurements require full M38535 testing for their microcircuits procured for space flight applications, as they are not secure with test optimization. This was followed by a discussion concerning the question of when a multi-chip module is a hybrid and vice versa. Currently there are a few hybrids QMLed under M38535 and some multi-chip modules under M38534. There are considerable differences between the specifications; 38535 generally is considered more rigorous than 38534. DSCC uses the rule that parts containing only chips from the same Federal Supply Class (FSC) (5962 for microcircuits, including hybrids) are considered multi-chip modules and come under 38535, and parts containing devices from multiple FSCs are considered hybrids covered by 38534. Test Optimization: M883 devics with a C compliancy mark gets all testing and no mark. If an M883 device has a Q mark, it is a Class Q part with an M883 part number. Extensive changes have been made to MIL-STD-883 Draft Revision F. These include updates to Test Method1014 to reflect improved laser technology for optical leak-testing equipment. DSCC has provided a very good summary of the changes that should make change review much more efficient. The discussion of test optimization shows that most people understand what is needed to operate test optimization responsibly; however, there is no single consistent approach. There is a JEDEC Guidelines document, JEP121, for optimization, and it is referenced in 38535. The 38535 is referenced in a note in paragraph 3.1. It does not appear that JEP121 is being used by any party in the process. TM2018: For Test Method 2018, the changes proposed through Task Group 2001-2002 were accepted unanimously by the Task Group, and JC-13.2 voted to pass the change request forward to DSCC. Wire Criteria: Regarding criteria for crossing wires, advanced packages with high pin counts, especially multi-tier styles, may not meet current criteria that were relevant to older packages years ago. Aeroflex proposed changes to meet their needs some time ago. NASA and The Aerospace Corporation have provided input for modifications and a request for more information. The JC-13.2 committee agreed to pursue development of improved language for MIL-STD-883. Hermeticity: There is optimism that progress is being made based on Pernickas presentation during the RGA workshop. NASA asked whether optical leak testing works for UA and UB style packages. Experience in the13.2 committee is that it does not, but the equipment manufacturer claims that it does. Samples need to be provided for an evaluation. G-12 Space Parts Subcommittee Meeting NGS: The U.S. Air Force (AF) Space and Missile Systems Center (SMC) needs improved standards for such things as parts management. They would prefer to use an NGS such as AIAA-R-100, but one that is stronger and more robust. There are elements within SMC that would like to resurrect MIL-STD-1546 and 1547, but these documents are very outdated; many of the standards they reference no longer exist and may or may not have an NGS substitute. Even if an NGS does exist, it is probably too weak to meet SMC needs. MIL-STD-883 TM 1019/ELDRS: DSCC cited that for MIL-STD-883 Test Method 1019, enhanced low-dose rate sensitivity (ELDRS) requirements are still being discussed, but it has been decided to test parts to current requirements. The proposal is to add two new device types, 61 for tested for ELDRS and passed, 071 for tested and found to have no ELDRS effect, in addition to type 01, which is tested at high dose rate. This would provide clarity of the parts capability but would add many new part numbers. National Semiconductor discussed the extensive testing at Navy Crane to try to understand the fundamentals behind ELDRS. ASTM 1892 provides copious information on ELDRS, as well as guidelines. The JC-10 committee is working on terms and definitions pertaining to radiation hardness and testing. Accelerated methods for ELDRS are being investigated while the unaccelerated test is still needed for accurate characterization. European Space Agency (ESA) Updates: ESA stated that the ECSS-Q60-01 ESA Preferred Parts List has been issued. The derating and End Of Life document, ECSS-Q60-12, is ready for imminent release. ECSS documents and parts stock information are available through the ESCIES Web site. ESA is working to develop a second source for MOSFETs (other than International Rectifier). ESA has sent out a questionnaire on the topic of lead-free alloys to European suppliers to determine what they plan to do. ESA is exempt from the European legal activities and so does not have to go lead-free, but like NASA, they anticipate having to use lead-free parts and assemblies. Galileosat (a large global positioning system [GPS]), ESAs largest-ever project, has established rules to prevent EEE parts from export restrictions and other impediments to supply. ESA is trying to avoid International Traffic in Arms Regulations (ITAR) restrictions. Upcoming Meetings The next JC-22 committee meeting will be held April 20-22, 2004, at the Joint Electron Device Engineering Council (JEDEC) Headquarters in Arlington, Virginia. The Institute for Printed Circuits (IPC)/JEDEC Conference on Lead-Free will be held March 17-19, 2004, at the Marriott Hotel in San Jose, California. ESSCON, which should have occurred in Lisbon this year, has encountered difficulties and will be postponed to 2005. Summary of Action Items A Task Group is needed to develop a flow for plastic transistors; there is no precedent for surface-mount technology (SMT) plastic discretes. It must be determined whether G-12 needs to provide support to JEDEC more regularly. Access to public domain NASA advisories needs to be done via the NEPP/NASA Electronic Parts Assurance Group (NEPAG) Web site now that the Electrical, Electronic, and Electromechanical (EEE) Parts Information Management System (EPIMS) site is no longer operational. For the RGA report, the Task Group must review case studies and manufacturers data and address correlation and reproducibility; calibration; and leak testing and hermeticity and their effects on RGA, particularly for small packages. Regarding continuation of the Corona Test Method task, discussions need to continue with NASA JSC and be reported to the Space Working Group. Regarding the task involving MIL-STD-1580C, followup is needed on the discussion of adding some guidance on destructive physical analysis (DPA) (e.g., which parts should undergo DPA) to the space parts guidelines. Comments on the draft of the Long-Term Storage task are required by March 31, 2004. Comments should include replacement text to speed their incorporation into the draft. DSCC plans to test 1.0 cc packages (in the next week or so); 0.01 cc will be tried once experience on the easier package sizes has been accumulated. G-12 needs to send Pernicka some UB packages to test, especially for gross leaks. The Task Group needs to review JEP121 to determine whether it needs updating and to examine how it should be referenced to be more effective in 38535. Regarding criteria for crossing wires, JC-13.2 agreed to pursue development of improved language for 883. Regarding NASAs question of whether optical leak testing works for UA and UB packages, G-12 needs to provide samples for an evaluation.     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[ @Verdana?= *Cx Courier New;WingdingsA BCambria Math"qhk7Cf, B( B(!24'N'N 3QHP(?Xl-2!xx}Government Electronics and Information Technology Association (GEIA): Overview and January 2004 Committee Meeting Highlights>Government Electronics and Information Technology Association *EIA/GEIA, GEIA, January Committee meeting, EIA/GEIA Russell Young      Oh+'0h(p   $ 0 <HPX`Government Electronics and Information Technology Association (GEIA): Overview and January 2004 Committee Meeting Highlights@Government Electronics and Information Technology Association  EIA/GEIA ,EIA/GEIA, GEIA, January Committee meeting,NormalRussell Young3Microsoft Office Word@@d&@j^a@ʳ% B՜.+,D՜.+,l( hp   Microsoft('N 8Notes from the GEIA G-12 Meeting in Scottsdale, Arizona Title 8@ _PID_HLINKSAd\Vhttp://www.geia.org/{   !"#$%&'()*+,-./012345679:;<=>?ABCDEFGHIJKLMNOPQRSTUVWXYZ[\^_`abcdfghijkloRoot Entry Fp)S%qData 81Table@8WordDocument4nSummaryInformation(]DocumentSummaryInformation8eCompObjy  F'Microsoft Office Word 97-2003 Document MSWordDocWord.Document.89q