Flat Fan Design Team - Computer Action Team



Flat Air Moving Device:Product Design Specification ReportSponsored by Intel Corporation Group Winter 2011Bruk YimesgenKarmand RasheedBen FurstAlexander AseyevIntel Corporation Advisor: Jered WikanderPSU Faculty Advisor: Faryar Etesami Table of contentIntroduction ………………………………………………………………………………………………………………………2Explanation of This Document ……………………………………………………………………………………………3Mission Statement …………………………………………………………………………………………………………….3Completion Data ………………………………………………………………………………………………………………..3Project Plan ………………………………………………………………………………………………………………………..4Identification of Customers ………………………………………………………………………………………………..4Customer Feedback and Interviews ……………………………………………………………………………………5Product Design Specifications (PDS) …………………………………………………………………………………..6House of Quality ………………………………………………………………………………………………………………...8Technical Risk Management……………………………………………………………………………………………….8Conclusions …………………………………………………………………………………………………………………………9Appendix I – Project Timeline ……………………………………………………………………………………………10IntroductionIntel Corporation is the world's largest semiconductor manufacturer as well as the inventor of the x86 microprocessor found in most of the world's personal computers. Within Intel, the Mobile Platforms Group is responsible for investigating and developing innovative technologies for implementation in portable electronic devices such as laptops and hand held electronics.Electronics manufacturers are continually seeking to decrease the size of their products while simultaneously improving their performance. Inherent to this trend is an increase in the heat generated by electronic components. Removing this heat is critical to the reliability and performance of these components. Air moving devices play an integral role in this task by providing forced convection heat transfer.20141041182551Fan technology currently dominates the market for air movement in electronic cooling applications. Almost every computer has some variant of a fan incorporated into the design. Because of the utility, prevalence and long market presence of fan technology, it has been exhaustively researched and there is little room for improvement to current designs. Figure 1: Sunon company’s “Mighty Mini Fan” (8mm x 8mm x 3mm)To keep pace with the rapid shrinking of consumer electronics many fan manufacturers have simply scaled down their products (see figure 1). As traditional fan designs are miniaturized into the millimeter regime their efficiency is somewhat questionable. Is there a better method of moving air in the small form factor required by modern electronics? Intel is actively exploring this question by investigating novel methods of moving air. The goal of this project is to produce an air moving device that has a maximum thickness of 3 mm and utilizes unconventional methods to propel air. In addition, it must meet or exceed the current standards of air volume transport, air speed and pressure required by modern electronics. Explanation of This DocumentThis report defines the criteria put forth by Intel’s Mobile Platform Group for the design of a flat air moving device. In addition it outlines the project objectives and timeline for completion. Mission StatementThe Flat Air Moving Device Team intends to design and build an air movement device that meets or exceeds the criteria put forth in this document. In particular, the device will have a thickness no greater than 3mm and be able to provide air flow characteristics that are standard in current fan technology used in the cooling of pletion DateThe team will present and deliver a fully functional prototype along with comprehensive documentation to PSU and Intel on June 5, 2011. Project PlanA detailed Gantt chart for the project timeline is presented in Appendix A. Project milestones are listed below.Product Design Specifications document to be prepared by January 26, 2011Conceptual design is to be completed by February 23, 2011Detail design is to be completed by March 16, 2011Prototype is to be built and functioning by April 20, 2011Prototype testing is to be done by May 4, 2011Documentation of Design process to be finalized by May 27, 2011Customer IdentificationThe external customers for this project are Intel and the buyers and consumers of Intel’s products. The following is a list of the customers within Intel: AccountingPurchasingManufacturing MaintenanceQuality Control/Quality AssuranceLegalThe internal customers of this project are Intel’s Mobile Platform Research and Development division, PSU’s capstone faculty director Dr. Faryar Etesami as well as the Flat Air Moving Device Capstone Team. Customer Interviews and FeedbackIn the interview with Jered Wikander (Intel’s contact engineer) it was confirmed that the major requirements of the project are as follows. The completed air moving device should:have a thickness equal to or less than 3mmhave air flow characteristics that can satisfy the cooling requirements of current electronicsutilize new or creative ways of generating air flowJered considered other parameters such as footprint size and power consumption of secondary importance and flexible. It was emphasized that this is an exploratory project that will result in a proof of concept and that the future development of the device into a marketable product should not be the primary focus. These aspects will be dealt with by Intel if the project prototype shows effectiveness and a potential future.Product Design SpecificationsThis project has four major design goals to achieve. These goals are as follows: air volume transport, air speed, air pressure, and housing space. Each of these requirements are of the highest priority to the customers. Lower priority goals represent the flexible specifications assigned by Intel and the team. Figure 2: PDS Chart????Highest Priority in design????????Lowest Priority in designCategoryRequirementPriority MetricTargetCustomerVerificationPerformance???????Air volume transport????actual cubic feet per minute (acfm)0.01-0.1 acfmINTELTesting?Air speed????meters / second (m/s)0.1-1 m/sINTELTesting?Air pressure????inches of water (IWG)0.01-0.05 IWGINTELTesting?Thickness????mm3mmINTELPrototype?Power supply???Voltsless than or equal to 1 kV INTELPrototype?Power Consumption???WattsLess than 1 WattINTELDesign?Nominal operating conditions???Degrees Celsius and humidityIndoor ambient conditions INTELTesting?Footprint area???mmwithin 200 x 300 mmINTELDesignService life??years7 yrsINTELDesignFigure 3: PDS continuedCategoryRequirementPriority MetricTargetCustomerVerificationEnvironment???????Extreme operating conditions??Degrees CelsiusUp to 95° CINTELTesting?Durability??shockable to withstand 3 foot dropINTELTesting?Safety?Safety during Installation/ Service No sharp points or edges. All electrical meets UL and safety codes.Installer/ INTELPrototypeAdaptability???????ability to use in a variety of form functions???Yes/Noable to adapt without significant redesignINTELDesignMaintenance???????Ability to repair or replace mechanical parts?ease of access to mechanical partsMust be able to access if service life is determined to be less than 7 yearsINTELDesignManufacturing/ Installation???????Cost??DollarsLess than $10 per unit at 100,000 unitsINTELDesign?installation??timeTime to install falls within cost requirementsINTELDesign?manufacturing??timeManufacturing falls within cost requirementsINTELDesignMaterials???????nothing toxic or exotic??expense and safetyMust meet design cost requirementsINTELDesign????Highest Priority in design??????Lowest Priority in designHouse of Quality:The House of Quality table below correlates the requirements from the Product Design Specification section of this document with measurable quantities. The success of the final prototype will be evaluated based on the benchmarks shown below.??Engineering Parameters?Acfmm/sIWGmmkVW° Cyears$/100,000 unitsRequirementsCustomer?????????Air volume transportINTEL0.01 - 0.1????????Air velocityINTEL?0.1 - 1.0???????Air pressureINTEL??0.01 - 0.05??????ThicknessINTEL???3?????Power supplyINTEL????≤ 1????Power ConsumptionINTEL?????<1???Footprint areaINTEL???≤ 200x300?????Operating conditionsINTEL??????20 - 95??Service lifeINTEL???????7?CostINTEL????????≤ $10Priority LegendHigh priority???Lower priority?Technical Risk ManagementThere are many potential causes for the final prototype failing to meet the requirements outlined in this document. Some of the more likely causes of failure, along with mitigation plans, are listed below.Failure of device to meet air flow requirements because of design mistakes such as selection of an ineffective method of air propulsion. Mitigation plan: Thoroughly research and understand design possibilities before making design decisions.Inability to complete fabrication of prototype due to needed parts being unavailable. Mitigation plan: Ensure needed parts are available well before the construction phase of the project begins.Mechanical failure of device due to a component breaking. Mitigation plan: Make the design as robust as possible; if fragile parts exist ensure that a replicate is easily available.Conclusions:The project team’s objective is to design and prototype an air moving device that provides air flow comparable to currently available devices and has a maximum thickness of 3mm. The project will focus on developing a prototype that meets the inflexible parameters identified in the PDS while achieving or exceeding the more flexible parameters assigned as targets for the team. Intel’s challenge for the team is to meet these requirements with the development of a new and creative technology. A successfully designed miniature device could result in smaller PDA’s, thinner notebook computers and televisions.Appendix A: Gantt Chart ................
................

In order to avoid copyright disputes, this page is only a partial summary.

Google Online Preview   Download